SikaBond®-T21

Usage

• SikaBond-T21 may be used for solid and engineered wood floors (strips, long strips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as particleboard and plywood.
• Once cured Sikabond-T21 forms a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane to reduce moisture vapour transmission from the subfloor and acts as a sound reduction membrane.

Advantages

• Single material capable of operating as a wood floor adhesive, vapour retarding membrane and sound reduction layer.
• Extremely easy to trowel.
• Low odour
• Contains no water; will not cause swelling of wood flooring.
• Excellent ‘green grab’.
• Tenacious bond.
• 270% elongation.
• Suitable for common types of wood flooring.
• Especially good for problematic woods such as beech and bamboo.
• Bonds solid wood flooring up to 19 mm (3/4 in) thick and 20 cm (8 in) wide, and engineered planks up to 35.6 cm (14 in) wide directly to concrete with no length limitations.
• Eliminates sleepers and plywood over concrete and gypsum substrates.
• Permanently elastic – allows planks to expand and contract without damage to the adhesive.
• Compatible with in-floor, radiant heating.

Packaging

15.14 L (4 US gal.)

Colour

Light brown