SikaBond®-T55

Usage

• Bonding of solid and engineered wood flooring (strips, longstrips, planks, panels, boards) mosaic parquet, industrial parquet, wood paving (residential) as well as chipboards

Advantages

• 400 % Elongation
• Reduces stress on the substrate: the elastic, material-compatible adhesive reduces transverse stress between the wood floor and the substrate
• Extremely easy to spread, helping to accelerate installation and increasing productivit

• Fast-curing: unfinished wood flooring can be sanded after 12 hours of cure time
• Suitable for most common types of wood floors
• Especially good for problematic woods such as beech and bamboo
• Bonds solid wood flooring up to 19 mm (¾ in.) thick and 203 m (8 in) wide, and engineered planks up to 355 mm (14 in) wide directly to concrete without length limitations
• Suitable for in-floor radiant heat installation
• Permanently elastic; allows planks to expand and contract without reduction of bond.
• Does not contain water
• Suitable for bonding wood floors directly onto old ceramic tiles eliminating need for removal
• Footfall-sound-dampening adhesive, helping to create a quieter environment
• Eliminate sleepers and plywood over concrete substrates

Packaging

18.9 L (5 US gal.) pail

Colour

Tan